Ceramic substrate has the advantages of high heat dissipation, low thermal resistance, long life and voltage resistance. Strong mechanical stress, stable shape; high strength, high thermal conductivity, high insulation; strong bonding, anti-corrosion. Excellent thermal cycling performance, cycle times up to 50,000 times, high reliability. The same as PCB board (or IMS substrate) can be etched with a variety of graphic structures; non-polluting, non-polluting. Wide use temperature -55℃～850℃; coefficient of thermal expansion close to silicon, simplify the production process of power module.

Aluminium oxide substrate: the use of casting method for the production of alumina ceramic substrate, the product has a good thermal conductivity, insulation stability, resistance to thermal shock, wear-resistant acid and alkali and other advantages. Can be used in thick film hybrid integrated circuits HTC, LED ceramic heat sink base, power modules, semiconductor devices and other fields.